Dow Corning® 340 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.

• A grease-like silicon material, thickened with heat conductive metal oxides
• High thermal conductivity with low bleed
• No drying, hardening or melting
• Stable at high temperatures
• Suitable for the base and mounting studs of transistors, diodes and effective many heat sink devices