خمیر سیلیکون هیت سینک HEAT SINK داو DOW مدل: DOWSIL 340-  رنج دمای کارکرد:   50-  تا 200 درجه - کاربرد جهت سرعت بخشیدن به انتقال دما قطعات الکترونیک از قطعه به هیت سینک برای اینکه حرارت قطعات کمتر شده و جلوگیری از سوختن قطعه الکترونیک شود - وزن 142 گرم بصورت تیوپ - ساخت DOW CORNING یا DOWSIL آمریکا

DOWSIL™ 340 Heat Sink Compound

White, non-curing and non-flowing thermally conductive compound                                                                                                                     

Product Description

• Non-flowing
• Moderate thermal conductivity
• No need for ovens or curing
• Heat flow away from circuitry components can increase reliability
• Compliant with MIL-DTL-47113

APPLICATIONS

• DOWSIL™ 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.

TYPICAL PROPERTIES

Specification Writers: These values are not intended for use in preparing specifications.

DESCRIPTION

Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance.

Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).

These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.